Patent Assignment
Reel/Frame 065319/0975
Assignment of Assignor's Interest
Recorded: 2023-10-24
Pages: 3
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Solid-State Imaging Apparatus, Manufacturing Method Thereof, and Electronic Equipment
Application:
18/556,906 →
Publication:
US 2024/0222410