Patent Assignment
Reel/Frame 065322/0416
Assignment of Assignor's Interest
Recorded: 2023-10-24
Pages: 6
Assignors
CHAE, SOO DOO
Executed: 2023-04-27
BARON, MATTHEW
Executed: 2023-04-27
GILDEA, ADAM
Executed: 2023-04-27
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, AKASAKA BIZ TOWER, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Semiconductor Devices with Hybrid Bonding Layers and Process of Making the Same
Application:
18/309,678 →
Publication:
US 2024/0363564