Patent Assignment
Reel/Frame 065331/0873
Assignment of Assignor's Interest
Recorded: 2023-10-25
Pages: 4
Assignor
KONDO, MANABU
Executed: 2023-08-22
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Electronic Component, Sensor Module, And Method For Manufacturing Electronic Component