IP Library › Assignment 065339/0011
Patent Assignment
Reel/Frame 065339/0011

Assignment of Assignor's Interest

Recorded: 2023-10-25 Pages: 5
Assignors
CHEN, YENHENG
Executed: 2019-03-15
LIN, CHENGCHUNG
Executed: 2019-03-15
LIN, JANGSHEN
Executed: 2019-04-10
WU, CHENGTAR
Executed: 2019-03-15
Assignee
SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
78 CHANGSHAN AVENUE, JIANGYIN CITY, 214437, CHINA
Covered Property (1)
Fan-Out Antenna Packaging Structure and Preparation Method Thereof
Application: 16/170,984 →
Publication: US 2019/0333879
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 25, 2023
From: HO, CHIHON
To: SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
Reel/Frame 065349/0945 →