Patent Assignment
Reel/Frame 065347/0857
Assignment of Assignor's Interest
Recorded: 2023-10-25
Pages: 2
Assignor
SONG, CHOUNG KI
Executed: 2023-10-19
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Buffer Chip, Semiconductor Package Including Buffer Chip and Memory Chip, and Memory Module
Application:
18/494,614 →
Publication:
US 2024/0249767