IP Library › Assignment 065350/0746
Patent Assignment
Reel/Frame 065350/0746

Change of Name

Recorded: 2023-10-25 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Stacked Dies and Methods for Forming Bonded Structures
Application: 18/145,261 →
Publication: US 2023/0131849
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Oct 25, 2023
From: UZOH, CYPRIAN EMEKA; SITARAM, ARKALGUD R; ENQUIST, PAUL
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 065348/0202 →