Patent Assignment
Reel/Frame 065354/0290
Assignment of Assignor's Interest
Recorded: 2023-10-26
Pages: 7
Assignors
OH, SE WOUNG
Executed: 2023-07-18
KIM, HYUNG DONG
Executed: 2023-07-19
KOO, SANG MO
Executed: 2023-07-20
KIM, HAN SUNG
Executed: 2023-07-18
CHO, YOUNG DAE
Executed: 2023-07-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Semiconductor Device
Application:
18/384,008 →
Publication:
US 2024/0222468