Patent Assignment
Reel/Frame 065354/0782
Assignment of Assignor's Interest
Recorded: 2023-10-26
Pages: 6
Assignors
JANG, MINHO
Executed: 2023-10-22
KWON, DOOWON
Executed: 2023-10-22
KIM, DOYEON
Executed: 2023-10-23
LEE, GWIDEOKRYAN
Executed: 2023-10-23
LIM, KYUNGTAE
Executed: 2023-10-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Bonded Substrates and Manufacturing Method Thereof
Application:
18/384,025 →
Publication:
US 2024/0363665