Patent Assignment
Reel/Frame 065393/0059
Assignment of Assignor's Interest
Recorded: 2023-10-30
Pages: 3
Assignors
PARK, JIN SOO
Executed: 2023-10-17
JEON, BYUNG JUN
Executed: 2023-10-17
LEE, CHUL SEUNG
Executed: 2023-10-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component