Patent Assignment
Reel/Frame 065403/0160
Assignment of Assignor's Interest
Recorded: 2023-10-31
Pages: 4
Assignors
CHUNG, YEN LIN
Executed: 2023-10-29
LIN, KAO-CHENG
Executed: 2023-10-26
CHAN, WEI MIN
Executed: 2023-10-26
CHEN, YEN-HUEI
Executed: 2023-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit, System and Method of Forming the Same
Application:
18/498,350 →
Publication:
US 2024/0276696