Patent Assignment
Reel/Frame 065407/0078
Assignment of Assignor's Interest
Recorded: 2023-10-31
Pages: 3
Assignors
YANG, CHIH HSIN
Executed: 2023-10-30
WANG, MAO-NAN
Executed: 2023-10-30
CHEN, DIAN-HAU
Executed: 2023-10-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Through-Substrate via and Method for Forming the Same
Application:
18/498,689 →
Publication:
US 2024/0405069