Assignment of Assignor's Interest

Recorded: 2023-11-03 Pages: 2

Assignors

WU, BO-LUN

Executed: 2023-10-13

HSU, PO-YEN

Executed: 2023-10-13

KUO, TSE-MIAN

Executed: 2023-10-13

Assignee

WINBOND ELECTRONICS CORP.

NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN

Covered Property (1)

Method of Forming Memory Structure

Application: 18/495,339 →

Publication: US 2024/0147726