Patent Assignment
Reel/Frame 065479/0853
Assignment of Assignor's Interest
Recorded: 2023-11-07
Pages: 4
Assignors
FUJIMURA, TOSHINOBU
Executed: 2023-09-28
NAKASATO, KATSUMI
Executed: 2023-09-28
IIZUKA, MUNEAKI
Executed: 2023-09-28
Assignee
NOF CORPORATION
20-3, EBISU 4-CHOME, SHIBUYA-KU, TOKYO, 150-6012, JAPAN
Covered Property
(1)
Heat-Dissipating Circuit Board, Heat-Dissipating Member, and Production Method for Heat-Dissipating Circuit Board