Patent Assignment
Reel/Frame 065486/0687
Assignment of Assignor's Interest
Recorded: 2023-11-07
Pages: 8
Assignors
KIM, MIN JUNG
Executed: 2023-10-31
HAN, JIN AH
Executed: 2023-10-31
KIM, HEE HWAN
Executed: 2023-10-31
HONG, YONG HOON
Executed: 2023-10-31
KIM, KYOUNG SUK
Executed: 2023-11-02
PARK, JONG HYEOK
Executed: 2023-10-31
PARK, JIN HYUNG
Executed: 2023-10-31
CHUNG, DAE HYUK
Executed: 2023-10-31
CHA, JI HOON
Executed: 2023-10-31
Assignees
SEMES CO., LTD.
77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU, CHUNGCHEONGNAM-DO, CHEONAN-SI, KOREA, REPUBLIC OF
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Processing Substrate
Application:
18/387,713 →
Publication:
US 2024/0153792