Patent Assignment
Reel/Frame 065489/0594
Assignment of Assignor's Interest
Recorded: 2023-11-07
Pages: 6
Assignors
JI, MINSEUNG
Executed: 2023-05-03
BAEK, SEUNGDUK
Executed: 2023-05-04
JANG, AENEE
Executed: 2023-05-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package
Application:
18/387,656 →
Publication:
US 2024/0153898