Patent Assignment
Reel/Frame 065510/0873
Assignment of Assignor's Interest
Recorded: 2023-11-09
Pages: 6
Assignor
MORI, TAKAYUKI
Executed: 2023-10-06
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU,, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Substrate Attaching/Detaching Robot, Substrate Attaching/Detaching Method, and Film Formation Apparatus
Application:
18/505,581 →
Publication:
US 2024/0173852
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.