Patent Assignment
Reel/Frame 065545/0311
Assignment of Assignor's Interest
Recorded: 2023-11-13
Pages: 2
Assignor
SONG, CHOUNG KI
Executed: 2023-11-07
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Buffer Chip, Semiconductor Package Including Buffer Chip and Memory Chip, and Memory Module
Application:
18/507,901 →
Publication:
US 2024/0312509