Patent Assignment
Reel/Frame 065546/0069
Assignment of Assignor's Interest
Recorded: 2023-11-13
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Semiconductor Chip Having Through-Electrode
Application:
18/380,042 →
Publication:
US 2024/0194575