Patent Assignment
Reel/Frame 065546/0091
Assignment of Assignor's Interest
Recorded: 2023-11-13
Pages: 7
Assignors
LEE, JUN-BUM
Executed: 2023-08-31
KIM, JUNSOO
Executed: 2023-08-31
CHOI, JAE HYUN
Executed: 2023-08-31
KONG, DONGSIK
Executed: 2023-08-31
KWON, JIHYE
Executed: 2023-08-31
AN, TAEYOON
Executed: 2023-08-31
CHOI, HYUN SEUNG
Executed: 2023-08-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device
Application:
18/383,201 →
Publication:
US 2024/0315008