Patent Assignment
Reel/Frame 065561/0627
Assignment of Assignor's Interest
Recorded: 2023-11-14
Pages: 4
Assignors
CHEN, KUAN CHUN
Executed: 2023-11-09
SHANG, SHU AN
Executed: 2023-11-12
TANG, KAI-YI
Executed: 2023-11-10
HUANG, GUANG-SING
Executed: 2023-11-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Probe Head Structures for Circuit Probe Test Systems and Methods of Forming the Same