Patent Assignment
Reel/Frame 065564/0332
Assignment of Assignor's Interest
Recorded: 2023-11-15
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Manufacturing Method Therefor
Application:
18/226,049 →
Publication:
US 2024/0155828