IP Library › Assignment 065568/0874
Patent Assignment
Reel/Frame 065568/0874

Assignment of Assignor's Interest

Recorded: 2023-11-15 Pages: 3
Assignor
LIANTO, PRAYUDI
Executed: 2023-11-07
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Selective Dielectric Capping for Hybrid Bonding
Application: 63/547,222 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 15, 2023
From: TAN, CHUAN SENG
To: NANYANG TECHNOLOGICAL UNIVERSITY
Reel/Frame 065568/0988 →
Assignment of Assignor's Interest Jan 18, 2024
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 066164/0808 →