Patent Assignment
Reel/Frame 065573/0412
Assignment of Assignor's Interest
Recorded: 2023-11-15
Pages: 4
Assignors
YANAGIGAWA, HIROSHI
Executed: 2023-05-29
NIWAYAMA, HIDEKI
Executed: 2023-05-29
KUDOU, HIROYOSHI
Executed: 2023-06-06
MORI, KAZUHISA
Executed: 2023-05-28
WADA, KODAI
Executed: 2023-05-29
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same
Application:
18/509,874 →
Publication:
US 2024/0162143