Patent Assignment
Reel/Frame 065575/0311
Assignment of Assignor's Interest
Recorded: 2023-11-15
Pages: 4
Assignors
TONEGAWA, SUSUMU
Executed: 2023-10-19
AMMO, HIROAKI
Executed: 2023-10-14
HONJO, AKIKO
Executed: 2023-10-16
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Solid-State Imaging Apparatus and Method for Manufacturing the Same
Application:
18/561,210 →
Publication:
US 2024/0258344