IP Library › Assignment 065575/0414
Patent Assignment
Reel/Frame 065575/0414

Assignment of Assignor's Interest

Recorded: 2023-11-15 Pages: 3
Assignors
LAI, YEN-YU
Executed: 2023-08-17
HSU, CHIH YAO
Executed: 2023-08-17
Assignee
GEMTEK TECHNOLOGY CO., LTD.
NO.15-1, ZHONGHUA ROAD., HINCHU INDUSTRIAL PARK, HUKOU, HSINCHU, TAIWAN
Covered Property (1)
Communication Assembly and Heat Dissipation Shielding Module Thereof
Application: 18/388,497 →
Publication: US 2025/0020879