Patent Assignment
Reel/Frame 065592/0576
Assignment of Assignor's Interest
Recorded: 2023-11-17
Pages: 9
Assignors
LEE, HYUN SOO
Executed: 2023-10-30
KANG, HAE MI
Executed: 2023-10-30
CHOI, DO HYUN
Executed: 2023-10-30
YONG, IL GU
Executed: 2023-10-30
LEE, JONG KYU
Executed: 2023-10-30
HAN, HO GEUN
Executed: 2023-10-30
SONG, JU YOUNG
Executed: 2023-10-30
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, PYEONGTAEK-SI, GYEONGGI-DO, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Component for Semiconductor Device Fabrication Apparatus, Semiconductor Device Fabrication Apparatus Including the Same, and Method of Fabricating Semiconductor Device
Application:
18/512,021 →
Publication:
US 2024/0170266
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 23, 2024
From: SK ENPULSE CO.
To: SOLMICS CO., LTD.
Reel/Frame 067502/0481 →
Corrective Assignment to Correct the the Assignor's Name from Sk Enpulse Co. to Sk Enpulse Co., Ltd Previously Recorded at Reel: 67502 Frame: 481. Assignor(S) Hereby Confirms the Assignment.
May 28, 2024
From: SK ENPULSE CO., LTD.
To: SOLMICS CO., LTD.
Reel/Frame 067555/0822 →