Patent Assignment
Reel/Frame 065593/0001
Assignment of Assignor's Interest
Recorded: 2023-11-17
Pages: 8
Assignors
HUANG, XIN-HUA
Executed: 2020-03-27
YU, CHUNG-YI
Executed: 2020-04-23
LIN, YEONG-JYH
Executed: 2020-04-07
CHU, REI-LIN
Executed: 2020-03-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3D Trench Capacitor for Integrated Passive Devices