IP Library Assignment 065593/0076
Patent Assignment
Reel/Frame 065593/0076

Assignment of Assignor's Interest

Recorded: 2023-11-17 Pages: 3
Assignors
HUANG, YUAN-SHENG
Executed: 2021-01-06
CHEN, YI-CHEN
Executed: 2021-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Trench Pattern for Trench Capacitor Yield Improvement
Application: 18/512,096 →
Publication: US 2024/0088210