IP Library › Assignment 065611/0334
Patent Assignment
Reel/Frame 065611/0334

Assignment of Assignor's Interest

Recorded: 2023-11-16 Pages: 4
Assignors
JEONG, WONTAE
Executed: 2019-06-25
PARK, EUNGKYU
Executed: 2019-06-24
LEE, DONGYEOP
Executed: 2019-06-25
KIM, YONGHWA
Executed: 2019-06-25
LEE, GIHOON
Executed: 2019-06-25
LEE, JAEHWAN
Executed: 2019-06-25
CHOI, SEUNGBUM
Executed: 2019-06-25
CHOI, HYOUNGGIL
Executed: 2019-07-01
HEO, CHANGRYONG
Executed: 2019-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Electronic Device with Sealing Structure
Application: 18/511,858 →
Publication: US 2024/0089642