Patent Assignment
Reel/Frame 065617/0024
Assignment of Assignor's Interest
Recorded: 2023-11-20
Pages: 10
Assignors
TONOUCHI, SHUNSUKE
Executed: 2023-11-01
KITAJIMA, TAKAYO
Executed: 2023-11-02
MAGOTA, SEIYA
Executed: 2023-11-02
AOYAMA, KAZUKI
Executed: 2023-11-11
TOSAKA, YUJI
Executed: 2023-11-01
SHIMAOKA, SHINJI
Executed: 2023-11-01
SAITOH, TAKESHI
Executed: 2023-11-01
NAKANISHI, KOTA
Executed: 2023-11-01
SASAKI, RYOHTA
Executed: 2023-11-01
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 1057325, JAPAN
Covered Property
(1)
Prepreg, Laminated Plate, Metal-Clad Laminated Plate, Printed Wiring Board, Semiconductor Package, Method for Manufacturing Prepreg, and Method for Manufacturing Metal-Clad Laminated Plate
Application:
18/562,166 →
Publication:
US 2024/0247120
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.