Patent Assignment
Reel/Frame 065619/0219
Assignment of Assignor's Interest
Recorded: 2023-11-20
Pages: 7
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2022-03-23
WU, WEI-CHENG
Executed: 2022-03-23
HUANG, WEN-TUO
Executed: 2022-03-27
LIN, CHIA-SHENG
Executed: 2022-03-27
WU, WEI CHUANG
Executed: 2023-11-13
YANG, SHIH KUANG
Executed: 2022-03-23
HUANG, CHUNG-JEN
Executed: 2022-05-08
LIN, SHUN-KUAN
Executed: 2022-04-25
LIU, CHIEN LIN
Executed: 2022-03-24
CHEN, PING-TZU
Executed: 2022-03-30
TU, YUNG CHUN
Executed: 2022-05-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Shared Pad/Bridge Layout for a 3D Ic