Patent Assignment
Reel/Frame 065622/0860
Assignment of Assignor's Interest
Recorded: 2023-11-20
Pages: 5
Assignors
KANG, SUNGCHAN
Executed: 2023-09-18
SON, DAEHYUK
Executed: 2023-09-18
HONG, SEOGWOO
Executed: 2023-09-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with 2-Phase Cooling Structure
Application:
18/514,514 →
Publication:
US 2024/0321680