IP Library › Assignment 065631/0214
Patent Assignment
Reel/Frame 065631/0214

Change of Name

Recorded: 2023-11-20 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Sealed Bonded Structures and Methods for Forming the Same
Application: 16/839,756 →
Publication: US 2020/0395321
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest Nov 20, 2023
From: KATKAR, RAJESH; SITARAM, ARKALGUD R.; MIRKARIMI, LAURA WILLS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 065619/0378 →