Assignment of Assignor's Interest

Recorded: 2023-11-21 Pages: 6

Assignors

MORIYA, TOSHIMITSU

Executed: 2023-11-07

ICHIMURA, TAKAYUKI

Executed: 2023-11-07

MIYAJI, MASAYUKI

Executed: 2023-11-07

KOBAYASHI, RYOHTA

Executed: 2023-11-07

ISHIKAWA, KAZUNORI

Executed: 2023-10-23

ITO, TSUBASA

Executed: 2023-10-17

Assignees

RESONAC CORPORATION

9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN

SIKA TECHNOLOGY AG

ZUGERSTRASSE 50, BAAR, CH-6340, SWITZERLAND

Covered Property (1)

Hardener, Adhesive Composition, Adhesive Film for Circuit Connection, Connected Structure, and Method for Producing Connected Structure

Application: 18/555,190 →

Publication: US 2024/0209182

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.