Patent Assignment
Reel/Frame 065711/0719
Assignment of Assignor's Interest
Recorded: 2023-11-30
Pages: 4
Assignors
CHIANG, YU-HO
Executed: 2023-10-23
CHANG, WEI-CHEN
Executed: 2023-10-23
CHAO, JIUN-JIE
Executed: 2023-11-16
CHEN, JYH-HUEI
Executed: 2023-10-29
CHENG, JYE-YEN
Executed: 2023-10-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure Including Bottom Isolation and Method for Manufacturing the Same
Application:
18/498,953 →
Publication:
US 2025/0142881