Patent Assignment
Reel/Frame 065719/0242
Assignment of Assignor's Interest
Recorded: 2023-11-30
Pages: 3
Assignors
LEE, DAL JIN
Executed: 2023-11-21
KANG, YANG BEOM
Executed: 2023-11-22
SHIN, KANG SUP
Executed: 2023-11-22
Assignee
KEY FOUNDRY CO., LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Die
Application:
18/524,809 →
Publication:
US 2024/0355631
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.