IP Library Assignment 066794/0290
Patent Assignment
Reel/Frame 066794/0290

Change of Name

Recorded: 2024-03-12 Pages: 25
Assignor
KEY FOUNDRY CO., LTD.
Executed: 2024-01-30
Assignee
SK KEYFOUNDRY INC.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Properties (274)
Modulator of Phase Shift Keying (Psk) Type
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Plate for Forming Metal Wires and Method of Forming Metal Wires Using the Same
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Publication: US US20040123921A1
Method of Forming Isolation Films in Semiconductor Devices
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Publication: US US20040082177A1
Method for Forming Isolation Film for Semiconductor Devices
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Publication: US US20050020075A1
Method of Forming Metal Line Layer in Semiconductor Device
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Publication: US US20050014381A1
Method for Forming Isolation Layer of Semiconductor Device
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Publication: US US20050009292A1
Method for Fabricating Merged Logic Cmos Device
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Publication: US US20040152273A1
Method for Manufacturing a Nonvolatile Memory Transistor
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Publication: US US20050020012A1
Method for Manufacturing a Semiconductor Device
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Publication: US US20050014333A1
Test Pattern of Semiconductor Device
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Publication: US US20050077514A1
Method for Fabricating Semiconductor Device
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Publication: US US20050101122A1
Method for Forming Low-K Dielectric Layer of Semiconductor Device
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Publication: US US20050106862A1
Method of Manufacturing Semiconductor Device
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Application: 10/878,478 →
Publication: US US20050106857A1
Radio Frequency Semiconductor Device and Method of Manufacturing the Same
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Publication: US US20050139954A1
Method for Forming Metal Wires in Semiconductor Device
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Publication: US US20050233579A1
Method for Forming Inductor in Semiconductor Device
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Publication: US US20050142778A1
Radio Frequency Integrated Circuit, and Method for Manufacturing the Same
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Publication: US US20050139955A1
Method for Forming Inductor in Semiconductor Device
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Publication: US US20050130423A1
Method for Forming Interlayer Insulation Film in Semiconductor Device
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Publication: US US20050142848A1
Cmos Output Buffer Circuit
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Application: 10/879,301 →
Publication: US US20050093585A1
Test Pattern for Reliability Measurement of Copper Interconnection Line Having Moisture Window and Method for Manufacturing the Same
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Application: 10/882,536 →
Publication: US US20050106764A1
Nonvolatile Memory Device and Method for Manufacturing the Same
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Publication: US US20050093056A1
Method for Manufacturing a Non-Volatile Memory Device
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Application: 10/983,443 →
Publication: US US20050142755A1
Method of Improving Residue and Thermal Characteristics of Semiconductor Device
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Publication: US US20050227486A1
Method of Forming Metal Wiring for High Voltage Element
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Publication: US US20050153549A1
Device for Electrostatic Discharge Protection and Circuit Thereof
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Publication: US US20050173765A1
Device for Electrostatic Discharge Protection and Method of Manufacturing the Same
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Publication: US US20050212050A1
Generator for Supplying Reference Voltage and Reference Current of Stable Level Regardless of Temperature Variation
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Publication: US US20050264346A1
Method of Manufacturing Semiconductor Device
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Publication: US US20050260822A1
Structure of Dummy Pattern in Semiconductor Device
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Publication: US US20050263904A1
Method for Removing Photoresist Layer and Method for Forming Metal Line in Semiconductor Device Using the Same
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Application: 11/146,538 →
Publication: US US20060128151A1
Flash Cell Using a Piezoelectric Effect
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Application: 11/160,332 →
Publication: US US20060284239A1
Parallel Capacitor of Semiconductor Device
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Application: 11/159,733 →
Publication: US US20050285226A1
Wafer Alignment Method
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Application: 11/167,960 →
Publication: US US20060110906A1
Semiconductor Device Manufacturing Method
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Publication: US US20070026592A1
Method for Manufacturing and Operating a Non-Volatile Memory
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Publication: US US20070012992A1
Non-Volatile Memory Device and Method for Fabricating the Same
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Publication: US US20060118857A1
Electrostatic Discharge Protection Device
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Publication: US US20060097321A1
Method for Fabricating Semiconductor Device
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Application: 11/282,810 →
Publication: US US20070010096A1
Method for Fabricating Module of Semiconductor Chip
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Publication: US US20060148232A1
Method for Fabricating Semiconductor Device
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Application: 11/296,117 →
Publication: US US20060246659A1
Electro-Static Discharge Protection Circuit and Method for Fabricating the Same
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Publication: US US20060145260A1
Non-Volatile Memory Device Having Selection Gates Formed on the Sidewalls of Dielectric Layers
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Application: 11/319,567 →
Publication: US US20060203543A1
Method for Fabricating Semiconductor Device
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Publication: US US20060228882A1
Device for Electrostatic Discharge Protection and Method of Manufacturing the Same
Patent: 7,361,957 →
Application: 11/426,037 →
Publication: US US20060244072A1
System and Method for Differential Efuse Sensing Without Reference Fuses
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Application: 11/427,849 →
Publication: US US20080002451A1
Semiconductor Device
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Application: 11/528,592 →
Publication: US US20070069280A1
Esd Protection Circuit
Patent: 7,746,609 →
Application: 11/595,942 →
Publication: US US20070109698A1
Non-Volatile Memory Device
Patent: 7,772,638 →
Application: 11/647,203 →
Publication: US US20070152262A1
Epitaxial silicon wafer and method for fabricating the same
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Application: 11/730,885 →
Publication: US US20070298591A1
Semiconductor Integrated Circuit
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Application: 11/785,673 →
Publication: US US20070252731A1
High Power Device Isolation and Integration
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Application: 11/741,889 →
Publication: US US20080265363A1
Structure for Differential Efuse Sensing Without Reference Fuses
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Application: 11/769,925 →
Publication: US US20080001251A1
Transistor Having Recess Channel and Fabricating Method Thereof
Patent: 7,767,530 →
Application: 11/898,991 →
Publication: US US20080150015A1
High Voltage Device
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Application: 12/216,870 →
Publication: US US20090014815A1
Non-Volatile Memory Device and Method for Fabricating the Same
Patent: 8,093,631 →
Application: 12/228,211 →
Publication: US US20080296654A1
Method of Forming Metal Wiring of Semiconductor Device
Patent: 41,653 →
Application: 12/284,848 →
Esd Protection Circuit
Patent: 7,795,637 →
Application: 12/318,303 →
Publication: US US20090166671A1
Semiconductor Device with Deep Trench Structure
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Application: 12/318,302 →
Publication: US US20090166744A1
Method of Manufacturing Semiconductor Device Including Forming a T-Shape Gate Electrode
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Application: 12/318,390 →
Publication: US US20090170253A1
Method for Forming Gate Oxide of Semiconductor Device
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Application: 12/318,392 →
Publication: US US20090179255A1
Method for Forming Gate of Semiconductor Device
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Application: 12/468,325 →
Publication: US US20090311854A1
Silicon Wafer and Fabrication Method Thereof
Patent: 7,977,216 →
Application: 12/500,901 →
Publication: US US20100078767A1
Insulator, Capacitor with the Same and Fabrication Method Thereof, and Method for Fabricating Semiconductor Device
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Publication: US US20100091428A1
Electrostatic Discharge Protection Device and Method for Manufacturing the Same
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Application: 12/504,173 →
Publication: US US20100133618A1
Capacitor Structure
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Application: 12/571,769 →
Publication: US US20100142119A1
Capacitor and Method for Fabricating the Same
Patent: 8,159,046 →
Application: 12/603,124 →
Publication: US US20100155889A1
Nonvolatile Memory Cell and Method for Fabricating the Same
Patent: 9,281,202 →
Application: 12/604,757 →
Publication: US US20100270605A1
Method for Forming Deep Trench in Semiconductor Device
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Application: 12/619,125 →
Publication: US US20100159669A1
High Power Device Isolation and Integration
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Publication: US US20100207233A1
Transistor Having Recess Channel and Fabricating Method Thereof
Patent: 8,637,923 →
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Publication: US US20100258865A1
Semiconductor Device
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Application: 12/835,523 →
Publication: US US20110115020A1
Semiconductor Device
Patent: 8,362,556 →
Application: 12/835,514 →
Publication: US US20110115016A1
Semiconductor Device
Patent: 8,076,726 →
Application: 12/836,503 →
Publication: US US20110133279A1
Semiconductor Device
Patent: 8,546,881 →
Application: 12/875,021 →
Publication: US US20110133277A1
Semiconductor Device and Method for Fabricating Semiconductor Device
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Publication: US US20110127612A1
Semiconductor Device and Method for Fabricating the Same
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Publication: US US20110260294A1
Schottky Diode and Method for Fabricating the Same
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Publication: US US20110233713A1
Semiconductor Device for Preventing Crack in Pad Region and Fabricating Method Thereof
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Publication: US US20110272818A1
Method for Forming Gate Oxide of Semiconductor Device
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Publication: US US20110057252A1
Semiconductor Device and Manufacturing Method Thereof
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Publication: US US20120007179A1
Nonvolatile Memory Device and Method for Fabricating the Same
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Publication: US US20110249500A1
Semiconductor Device with Mim Capacitor and Method for Manufacturing the Same
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Publication: US US20110108951A1
Element Isolation Structure of Semiconductor and Method for Forming the Same
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Publication: US US20120018840A1
Silicon Wafer and Fabrication Method Thereof
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Publication: US US20110227202A1
Semiconductor Device and Method of Fabricating the Same
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Publication: US US20120104564A1
Semiconductor Device
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Application: 13/290,535 →
Publication: US US20120049278A1
Semiconductor Device and Method for Fabricating the Same
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Application: 13/331,536 →
Publication: US US20120104504A1
Electro-Static Discharge Protection Device
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Publication: US US20130001686A1
Non-Volatile Memory Device and Method for Fabricating the Same
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Publication: US US20120142153A1
Capacitor and Method for Fabricating the Same
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Publication: US US20120171840A1
Isolation Structure, Semiconductor Device Having the Same, and Method for Fabricating the Isolation Structure
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Publication: US US20130075857A1
Nonvolatile Memory Device and Method of Manufacturing Thereof
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High Voltage Semiconductor Device
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Metal Wiring of Semiconductor Device and Method for Manufacturing the Same
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Publication: US US20140035146A1
High Voltage Device and Method for Fabricating the Same
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Publication: US US20130237027A1
Silicon Wafer and Fabrication Method Thereof
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Publication: US US20130270681A1
Semiconductor Device and Method for Fabricating the Same
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Publication: US US20130344678A1
Electrical Fuse and Method of Fabricating the Same
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Publication: US US20140091427A1
Semiconductor Device
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Publication: US US20140021542A1
Semiconductor Device
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Publication: US US20140021541A1
Semiconductor Device
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Publication: US US20140027846A1
Semiconductor Device and Method for Fabricating Semiconductor Device
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Publication: US US20140030862A1
Method for Wafer Level Reliability
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Semiconductor Device and Manufacturing Method Thereof
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Publication: US US20140291767A1
Semiconductor-Based Hall Sensor
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Publication: US US20150002140A1
Lateral Double-Diffused Mos Transistor Having Deeper Drain Region Than Source Region
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Publication: US US20140306285A1
Semiconductor Device and Manufacture Method Thereof
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Publication: US US20140367776A1
Semiconductor Power Device and Method of Fabricating the Same
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Publication: US US20140353749A1
Esd Transistor
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Publication: US US20140353799A1
Esd Transistor for High Voltage and Esd Protection Circuit Thereof
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Semiconductor Device and Manufacturing Method Thereof
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Publication: US US20140231927A1
Semiconductor Device
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Semiconductor Device and Manufacturing Method Thereof
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Publication: US US20150129959A1
Semiconductor Device
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Publication: US US20150228742A1
Non-Volatile Memory Device Having Asymmetrical Control Gates Surrounding a Floating Gate and Manufacturing Method Thereof
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Method of Fabricating a Ldmos Device Having a First Well Depth Less Than a Second Well Depth
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Method for Fabricating a Shorttky Diode Including a Guard Ring Overlapping an Insolation Layer
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A Semiconductor Device Having Circuitry Positioned Above a Buried Magnetic Sensor
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Low-Cost Semiconductor Device Manufacturing Method
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Method of Manufacturing Non-Volatile Memory Device
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Vertical Bipolar Junction Transistor and Manufacturing Method Thereof
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Publication: US US20150243770A1
Capacitor Type Humidity Sensor
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Vertical Hall Sensor, Hall Sensor Module and Method for Manufacturing the Same
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Publication: US US20160018478A1
Humidity Sensor with Void Within Interconnect and Method of Manufacturing the Same
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Semiconductor Device with Voids Within Silicon-on-Insulator (Soi) Structure and Method of Forming the Semiconductor Device
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Hall Sensor with Improved Doping Profile
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Semiconductor and Method of Fabricating the Same
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Insulator, Capacitor with the Same and Fabrication Method Thereof, and Method for Fabricating Semiconductor Device
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Semiconductor Device and Method of Fabricating the Same
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Publication: US US20150303252A1
Isolation Structure, Semiconductor Device Having the Same, and Method for Fabricating the Isolation Structure
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Semiconductor Device
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Publication: US US20160181419A1
Method of Manufacturing Non Volatile Memory Device
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Semiconductor Structure Having a Junction Field Effect Transistor and a High Voltage Transistor and Method for Manufacturing the Same
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Schottky Diode Having Floating Guard Rings
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Level Shifter and Non-Volatile Memory Device Using the Same
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Metal Wiring of Semiconductor Device and Method for Manufacturing the Same
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Semiconductor Device for Preventing Crack in Pad Region and Fabricating Method Thereof
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Semiconductor Device with Voids Within Silicon-on-Insulator (Soi) Structure and Method of Forming the Semiconductor Device
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One Time Programmable Non-Volatile Memory Device
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Method for Wafer Level Reliability
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Semiconductor and Method of Fabricating the Same
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Method of Manufacturing a Cmos Transistor
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Publication: US US20180025948A1
Single Poly Non-Volatile Memory Device, Method of Manufacturing the Same and Single Poly Non-Volatile Memory Device Array
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Method of Fabricating Dmos and Cmos Transistors
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Integrated Semiconductor Device and Method for Manufacturing the Same
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Display Driver Semiconductor Device and Manufacturing Method Thereof
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Low-Cost Semiconductor Device Manufacturing Method
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Semiconductor Device
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Publication: US US20170263763A1
Integrated Semiconductor Device Having Isolation Structure for Reducing Noise
Application: 15/685,697 →
Publication: US US20180182747A1
Display Driver Semiconductor Device and Manufacturing Method Thereof
Application: 15/826,974 →
Publication: US US20180083043A1
Method of Fabricating Dmos and Cmos Transistors
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Publication: US US20180096897A1
High Voltage Semiconductor Device
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Publication: US US20180350978A1
Semiconductor Device and Manufacturing Method Thereof
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Publication: US US20180166322A1
Semiconductor Structure Having a Junction Field Effect Transistor and a High Voltage Transistor and Method for Manufacturing the Same
Application: 15/915,105 →
Publication: US US20180197991A1
Semiconductor Device Having Circuitry Positioned Above a Buried Magnetic Sensor
Application: 15/956,885 →
Publication: US US20180240965A1
Tie-High and Tie-Low Circuits
Application: 15/985,007 →
Publication: US US20190012419A1
Semiconductor Device Comprising Schottky Barrier Diodes
Application: 15/992,515 →
Publication: US US20190103498A1
Decoupling Capacitor Circuit
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Publication: US US20190081038A1
Semiconductor Device Having a Deep-Trench Capacitor Including Void and Fabricating Method Thereof
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Publication: US US20190181217A1
Integrated Semiconductor Device Having Isolation Structure for Reducing Noise
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Publication: US US20180342497A1
Method of Manufacturing a Cmos Transistor
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Publication: US US20180350696A1
Power Semiconductor Device and Method for Manufacturing the Same
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Publication: US US20190288066A1
Semiconductor Device with High Voltage Field Effect Transistor and Junction Field Effect Transistor
Application: 16/123,253 →
Publication: US US20190013403A1
Single Poly Multi Time Program Cell and Method of Operating the Same
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Publication: US US20190237140A1
Integrated Semiconductor Device and Method for Manufacturing the Same
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Publication: US US20190035783A1
Semiconductor Device and Method for Manufacturing the Same
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Publication: US US20190386117A1
Insulator, Capacitor with the Same and Fabrication Method Thereof, and Method for Fabricating Semiconductor Device
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Publication: US US20190148139A1
Single Poly Non-Volatile Memory Device, Method of Manufacturing the Same and Single Poly Non-Volatile Memory Device Array
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Publication: US US20190172834A1
Method of Manufacturing a Cmos Transistor
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Publication: US US20190198401A1
Semiconductor Device and Manufacturing Method Thereof
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Publication: US US20190229685A1
Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
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Publication: US US20200343145A1
Semiconductor Device
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Publication: US US20200020801A1
High Voltage Semiconductor Device
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Publication: US US20200013889A1
Semiconductor and Method of Fabricating the Same
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Publication: US US20200043801A1
Display Driver Semiconductor Device and Manufacturing Method Thereof
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Publication: US US20200066759A1
Semiconductor Device with Controllable Channel Length and Manufacturing Method Thereof
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Publication: US US20210028166A1
Semiconductor Device with Electrostatic Discharge Protection
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Publication: US US20200373293A1
Semiconductor Device Comprising Schottky Barrier Diodes
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Publication: US US20200105947A1
Integrated Semiconductor Device and Method for Manufacturing the Same
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Nonvolatile Memory Device
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Electronic Fuse Cell Array Structure
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Single Poly Non-Volatile Memory Device, Method of Manufacturing the Same and Single Poly Non-Volatile Memory Device Array
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Semiconductor Device with Non-Volatile Memory Cell and Manufacturing Method Thereof
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Semiconductor Device with Single Poly Non-Volatile Memory Device and Manufacturing Method
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Mask-Programmable Read Only Memory with Electrically Isolated Cells
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Electrical Fuse One Time Programmable (Otp) Memory
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Non-Volatile Memory Octo Mode Program and Erase Operation Method with Reduced Test Time
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Semiconductor Device with Deep Trench Isolation Mask Layout
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Non-Volatile Memory Device Including Selection Gate and Manufacturing Method Thereof
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High Voltage Semiconductor Device with Esd Self-Protection Capability and Manufacturing Method Thereof
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Method of Manufacturing a Trench Capacitor with Wafer Bow
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Manufacturing Method of Non-Volatile Memory Device Having Uniform Dielectric Film Profile
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Semiconductor Device with Guard Ring Isolating Power Device
Application: 17/575,166 →
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eFUSE ONE-TIME PROGRAMMABLE MEMORY WITH INTER INTEGRATED CIRCUIT (I2C) COMMUNICATION AND OPERATION METHOD THEREOF
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Application: 17/665,927 →
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Embedded Flash Memory and Write Operation Method Thereof
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Manufacturing Method for Deep Trench Capacitor with Scalloped Profile
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Semiconductor Device with Digital Isolator Capacitor and Manufacturing Method Thereof
Application: 17/669,564 →
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Semiconductor Device with Controllable Channel Length and Manufacturing Method Thereof
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Low Power Retention Flip-Flop
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Semiconductor Device Having a Diode Type Electrical Fuse (E-Fuse) Cell Array
Application: 17/693,887 →
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Non-Volatile Memory Device with Parallel Programming
Application: 17/693,700 →
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Semiconductor Device with Bootstrap Diode
Application: 17/695,937 →
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Semiconductor Device Having a Non-Voltaile Memory with High Speed-Read Operation
Application: 17/696,947 →
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Nonvolatile Memory Device
Application: 17/728,290 →
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Semiconductor Device with Controllable Channel Length and Manufacturing Method of Semiconductor Device with Controllable Channel Length
Application: 17/735,500 →
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Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Application: 17/741,791 →
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Non-Volatile Memory Device Including Sense Amplifier and Method for Operating the Same
Application: 17/741,635 →
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Semiconductor Device Including Single Poly Non-Volatile Memory Device and Method of Manufacturing Same
Application: 17/743,691 →
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Manufacturing Method of Semiconductor Device Using Gate-Through Implantation
Application: 17/747,121 →
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Semiconductor Device with Increased Isolation Breakdown Voltage
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Bipolar-Cmos-Dmos Semiconductor Device Having a Deep Trench Isolation Structure for High Isolation Breakdown Voltage
Application: 17/965,094 →
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eFUSE OTP MEMORY DEVICE INCLUDING SERIAL INTERFACE LOGIC AND OPERATION METHOD THEREOF
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High Voltage Semiconductor Device and Manufacturing Method of High Voltage Semiconductor Device
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Non-Volatile Memory Device Having a Fuse Type Memory Cell Array
Application: 18/096,788 →
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Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Application: 18/111,079 →
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Semiconductor Device with Deep Trench Isolation
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Analog to Digital Converter and Operation Method Thereof
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Semiconductor Device and Method Having Deep Trench Isolation
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Semiconductor Device and Semiconductor Device Manufacturing Method with High-Voltage Isolation Capacitor
Application: 18/116,397 →
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Semiconductor Device Having High-Voltage Isolation Capacitor
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Manufacturing Method of a Semiconductor Device Having High-Voltage Isolation Capacitor
Application: 18/188,592 →
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Semiconductor Device Including Nonvolatile Memory Device and Logic Device and Manufacturing Method of Semiconductor Device Including Nonvolatile Memory Device and Logic Device
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Semiconductor Device Having High Breakdown Voltage Capacitor
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High Voltage Semiconductor Device Having Schottky Barrier Diode
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Non-Volatile Semiconductor Memory Device and Method of Manufacturing the Same
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Semiconductor Device with Increased Isolation Breakdown Voltage
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Semiconductor Device with Non-Volatile Memory Cell and Manufacturing Method Thereof
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Semiconductor Device with Controllable Channel Length and Manufacturing Method Thereof
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Semiconductor Device with Field Plate Structures
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Analog-To-Digital Converter and Operation Method Thereof
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High Voltage Semiconductor Device and Manufacturing Method of High Voltage Semiconductor Device
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Semiconductor Device Manufacturing Method
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Method of Manufacturing a Semiconductor Device Having a Trench Capacitor and a Logic Device
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Electrical Fuse One Time Programmable (Otp) Memory
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Bidirectional I/O Circuit and Integrated Circuit Including Bidirectional I/O Circuit
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Non-Volatile Semiconductor Memory Device and Manufacturing Method Thereof
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Single Poly Non-Volatile Memory Device and Manufacturing Method Thereof
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Non-Volatile Memory Device Including Sense Amplifier and Method for Operating the Same
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Split Gate Power Mosfet and Split Gate Power Mosfet Manufacturing Method
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Semiconductor Device Having a Low Resistivity Trench Capacitor
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Method for Manufacturing Semiconductor Die
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Method of Manufacturing a Semiconductor Device with Junction Fet Transistors Having Multi Pinch-Off Voltages
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Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest Aug 12, 2013
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 030988/0419 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party. Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Release of Security Interest Mar 13, 2025
From: BANK OF MONTREAL
To: WORKFUSION, INC.
Reel/Frame 070501/0409 →