IP Library Granted Patent US 10,236,297
Granted Patent B2
US 10,236,297 · App. 15/402,259 · Granted Mar 19, 2019

Single poly non-volatile memory device, method of manufacturing the same and single poly non-volatile memory device array

Inventors: Su Jin Kim (Cheonnan-si, KR); Hye Jin Yoo (Sejong, KR)
Assignee: MagnaChip Semiconductor, Ltd.
H01L27/11558G11C16/0408G11C16/10G11C16/14H01L27/11524H01L29/0847H01L29/1095H01L29/66825H01L29/7883
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Quick Facts
Patent No.
US 10,236,297
App. No.
15/402,259
Granted
Mar 19, 2019
Kind
B2
Abstract

A single poly non-volatile memory device that includes: a first type lower well; first and second wells separately formed in an upper portion of the first type lower well; a source electrode, a selection transistor, a sensing transistor, and a drain electrode sequentially disposed in an upper portion of the first well. A control gate is formed in an upper portion of the second well with separated on an opposite side of the source electrode from the first well and connected to the gate of the sensing transistor.

Claims (24)

1. A single poly non-volatile memory device, comprising:

a first type lower well;

a first well and a second well formed spaced apart from each other in an upper portion of the first type lower well;

a source electrode, a selection transistor, a sensing transistor, and a drain electrode sequentially disposed in an upper portion of the first well;

first, second, and third doping regions disposed in an upper portion of the first well and formed adjacent to the selection transistor and the sensing transistor; and

a control gate formed in an upper portion of the second well, separated on an opposite side of the source electrode from the first well and connected to a gate of the sensing transistor.

2. The single poly non-volatile memory device of claim 1 , wherein the gate of the sensing transistor is implemented into a tunneling area that provides a moving passage of electrons toward a lower end thereof.

3. The single poly non-volatile memory device of claim 1 , further comprising:

a first active area comprising the selection transistor and the sensing transistor; and

a second active area comprising the control gate and separated from the first active area.

4. The single poly non-volatile memory device of claim 1 , wherein the control gate is connected to the gate of the sensing transistor, and

wherein the control gate and the gate of the sensing transistor form a floating gate.

5. The single poly non-volatile memory device of claim 1 , further comprising:

a first diffusion area disposed at a lower portion of the source electrode and adjacent to the first doping layer.

6. The single poly non-volatile memory device of claim 1 , wherein the second doping layer shares a drain area of the selection transistor and a source area of the sensing transistor.

7. The single poly non-volatile memory device of claim 1 , wherein the third doping layer corresponds to a drain area of the sensing transistor, and comprises a drain electrode in an upper portion thereof.

8. The single poly non-volatile memory device of claim 3 , further comprising:

a control gate electrode formed at one side of the control gate in an upper portion of the second well; and

a second diffusion area disposed in a lower portion of the control gate electrode.

9. The single poly non-volatile memory device of claim 8 , wherein the second active area comprises an entire area of the control gate and the control gate electrode to improve operation efficiency of the control gate.

10. The single poly non-volatile memory device of claim 8 , wherein the second active area further comprises an implant area formed in an upper portion of the second well to be disposed at a lower end of the control gate.

11. The single poly non-volatile memory device of claim 8 , wherein program and erase operation voltages are applied through the source electrode and the control gate.

12. The single poly non-volatile memory device of claim 11 , wherein a negative voltage is applied to the source electrode and a positive voltage is applied to the control gate, upon a program operating, and

a positive voltage is applied to the source electrode and a negative voltage is applied to the control gate, upon an erase operating.

Assignments (3)
CHANGE OF NAME Recorded Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2017
From: KIM, SU JIN; YOO, HYE JIN
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 040909/0163 →
Priority Claims (1)
KR 10-2016-0005621 · Jan 15, 2016 · national
Continuity (1)
Related Publication 20170207231A1 · Jul 20, 2017