Power semiconductor device and method for manufacturing the same

1. A power semiconductor device, comprising:

a drain region and a source region disposed on a substrate;

a gate insulating layer and a gate electrode disposed on the substrate and disposed between the drain region and the source region;

a protection layer in contact with a top surface of the substrate and a top surface of the gate electrode;

a source contact plug connected to the source region;

a drain contact plug connected to the drain region; and

a field plate plug in contact with the protection layer,

wherein a width of the field plate plug is greater than a width of the source contact plug or a width of the drain contact plug,

wherein a bottom surface of the field plug has a non-planar surface, and a top surface of the field plate plug is flat.

2. The power semiconductor device of claim 1 , wherein a portion of the field plate plug vertically overlaps with the gate electrode.

3. The power semiconductor device of claim 1 , wherein the protection layer comprises:

a first region disposed on the gate electrode;

a second region disposed on the substrate; and

a third region connecting the first region with the second region, wherein

the field plate plug vertically overlaps with the second region.

4. The power semiconductor device of claim 3 , wherein the field plate plug has a first length on the first region, the field plate plug has a second length on the second region, and the second length is greater than the first length.

5. The power semiconductor device of claim 4 , wherein the width of the field plate plug is greater than the first length.

6. The power semiconductor device of claim 1 , further comprising:

an interlayer insulating layer disposed on the gate electrode and the protection layer,

wherein the field plate plug penetrates through the interlayer insulating layer.

7. The power semiconductor device of claim 1 , further comprising:

a conductive line connecting the source contact plug to the field plate plug, wherein the field plate plug is in direct contact with the conductive line.

8. The power semiconductor device of claim 1 , further comprising:

a first conductivity type buried layer disposed on the substrate; and

a second conductivity type buried layer disposed on the first conductivity type buried layer.

9. The power semiconductor device of claim 1 , further comprising:

a first conductivity type drift region and a second conductivity type body region disposed on the substrate.

10. The power semiconductor device of claim 9 , wherein the gate insulating layer is disposed between the gate electrode and the first conductivity type drift region, and the gate insulating layer is disposed between the gate electrode and the second conductivity type body region.

11. The power semiconductor device of claim 9 , wherein the drain region is a first conductivity type drain region and is disposed in the first conductivity type drift region.

12. The power semiconductor device of claim 1 , further comprising a silicide layer disposed on a top surface of the drain region.

13. The power semiconductor device of claim 1 , wherein when viewed as a plane, the field plate plug is provided as having a single plate shape provided on the protection layer.

14. The power semiconductor device of claim 1 , wherein a portion of the protection layer is in contact with the drain region.

15. The power semiconductor device of claim 1 , further comprising an etch stop layer disposed between a bottom surface of the field plate plug and a top surface of the protection layer.

16. The power semiconductor device of claim 1 , further comprising:

spacers provided at sidewalls of the gate electrode,

wherein the field plate plug vertically overlaps with the spacers.

17. A method for manufacturing a power semiconductor device, comprising:

providing a substrate;

forming a gate insulating layer and a gate electrode on the substrate;

forming a drain region and a source region on the substrate;

forming a protection layer on the gate electrode;

forming an interlayer insulating layer disposed on the gate electrode and the protection layer;

forming a source contact hole, a drain contact hole, and a field plate hole, which expose the source region, the drain region, and the protection layer, respectively, by etching the interlayer insulating layer; and

forming a source contact plug connected to the source region, a drain contact plug connected to the drain region, and a field plate plug contacting the protection layer, respectively, by filling the source contact hole, the drain contact hole, and the field plate hole, respectively with a conductive material,

wherein a width of the field plate plug is greater than a width of the source contact plug or a width of the drain contact plug,

wherein a bottom surface of the field plug has a non-planar surface, and a top surface of the field plate plug is flat.

18. The method of claim 17 , wherein the providing of the substrate comprises:

forming a first conductivity type buried layer on the substrate;

forming a second conductivity type buried layer on the first conductivity type buried layer; and

forming a first conductivity type drift region and a second conductivity type body region on the second conductivity type buried layer.

19. The method of claim 17 , further comprising:

forming a conductive line connecting the source contact plug to the field plate plug.

20. The method of claim 17 , further comprising:

forming a silicide layer on each of a top surface of the gate electrode, a top surface of the source region, and a top surface of the drain region.