IP Library Granted Patent US 7,385,253
Granted Patent B2
US 7,385,253 · App. 11/051,858 · Granted Jun 10, 2008

Device for electrostatic discharge protection and circuit thereof

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Quick Facts
Patent No.
US 7,385,253
App. No.
11/051,858
Granted
Jun 10, 2008
Kind
B2
Abstract

Disclosed herein are a device for electrostatic protection and circuit thereof. According to the present invention, a device for electrostatic discharge protection comprises first to third wells formed on a semiconductor substrate, a first device, which includes a well pick-up region, a source region and a double diffused drain region, which are formed in predetermined regions on the first well, and a gate formed in a predetermined region on the semiconductor substrate, a second device, which includes a source region, a double diffused drain region and a first active region, which are formed in predetermined regions on the second well, and a gate formed in a predetermined region on the semiconductor substrate, and a second active region formed on the third well, wherein the gate, the source region and the well pick-up region of the first device are connected to a ground pad; the drain of the first device, and the source and the gate of the second device are connected to a power source pad; and the drain and the first active region of the second device, and the second active region are connecter to an I/O pad. Therefore, a single ESD protection device can cope with ESD stress of six modes, which can occur in each of I/O cells. Accordingly, a layout area necessary for ESD protection can be reduced.

Claims (28)

1. A circuit for electrostatic discharge protection, comprising:

an input buffer, which is connected between a power source pad and a ground pad and has one terminal connected to an I/O pad; and

a device for electrostatic discharge protection, which is connected between the power source pad, the ground pad and the I/O pad.

2. The circuit as claimed in claim 1 , wherein the device for electrostatic discharge protection comprises:

first to third wells formed on a semiconductor substrate;

a first device, which includes a well pick-up region, a source region and a double diffused drain region, which are formed in predetermined regions on the first well, and a gate formed in a predetermined region on the semiconductor substrate;

a second device, which includes a source region, a double diffused drain region and a first active region, which are formed in predetermined regions on the second well, and a gate formed in a predetermined region on the semiconductor substrate; and

a second active region formed on the third well,

wherein the gate, the source region and the well pick-up region of the first device are connected to a ground pad; the drain of the first device, and the source and the gate of the second device are connected to a power source pad; and the drain and the first active region of the second device, and the second active region are connecter to an I/O pad.

3. A circuit for electrostatic discharge protection, comprising:

an output buffer, which is connected between a power source pad and a ground pad and has one terminal connected to an I/O pad; and

a device for electrostatic discharge protection, which is connected between the power source pad, the ground pad and the I/O pad.

4. The circuit as claimed in claim 3 , wherein the device for electrostatic discharge protection comprises:

first to third wells formed on a semiconductor substrate;

a first device, which includes a well pick-up region, a source region and a double diffused drain region, which are formed in predetermined regions on the first well, and a gate formed in a predetermined region on the semiconductor substrate;

a second device, which includes a source region, a double diffused drain region and a first active region, which are formed in predetermined regions on the second well, and a gate formed in a predetermined region on the semiconductor substrate; and

a second active region formed on the third well,

wherein the gate, the source region and the well pick-up region of the first device are connected to a ground pad; the drain of the first device, and the source and the gate of the second device are connected to a power source pad; and the drain and the first active region of the second device, and the second active region are connecter to an I/O pad.

5. A circuit for electrostatic discharge protection, comprising:

an input buffer, which is connected between a power source pad and a ground pad and has one terminal connected to an I/O pad;

an output buffer, which is connected between a power source pad and a ground pad and has one terminal connected to an I/O pad; and

a device for electrostatic discharge protection, which is connected between the power source pad, the ground pad and the I/O pad.

6. The circuit as claimed in claim 5 , wherein the device for electrostatic discharge protection comprises:

first to third wells formed on a semiconductor substrate;

a first device, which includes a well pick-up region, a source region and a double diffused drain region, which are formed in predetermined regions on the first well, and a gate formed in a predetermined region on the semiconductor substrate;

a second device, which includes a source region, a double diffused drain region and a first active region, which are formed in predetermined regions on the second well, and a gate formed in a predetermined region on the semiconductor substrate; and

a second active region formed on the third well,

wherein the gate, the source region and the well pick-up region of the first device are connected to a ground pad; the drain of the first device, and the source and the gate of the second device are connected to a power source pad; and the drain and the first active region of the second device, and the second active region are connecter to an I/O pad.

Assignments (6)
CHANGE OF NAME Recorded Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 024563 FRAME: 0807. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE BY SECURED PARTY. Recorded Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
RELEASE OF SECURITY INTEREST Recorded Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
AFTER-ACQUIRED INTELLECTUAL PROPERTY KUN-PLEDGE AGREEMENT Recorded Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2005
From: KIM, KIL HO
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016402/0065 →