Method of forming metal wiring for high voltage element
View Patent ↗Disclosed herein is a method of forming metal wirings for high voltage elements. According to the present invention, after a copper film is formed, a wet etch process using an interlayer insulating film as an etch mask is performed to pattern the copper film. It is thus possible to form copper wirings for high voltage elements the width of which is very wide. Furthermore, a wet etch process using a chemical aqueous solution is performed instead of a copper polishing process. The cost for forming a metal wiring can be thus saved. Moreover, by controlling a wet etch time, the space between metal wirings, which is narrower than a width of the metal wiring, can be secured sufficiently.
1. A method of forming metal wirings for high voltage elements, comprising:
(a) forming a copper anti-diffusion metal film, a copper film, a first copper anti-diffusion insulating film, and a first interlayer insulating film over a semiconductor substrate in which high voltage elements are formed;
(b) patterning the first interlayer insulating film and the first copper anti-diffusion insulating film, wherein the copper film is opened in a region where copper wirings are not formed; and
(c) performing an etch process on the copper film and the copper anti-diffusion metal film using a chemical solution in which the first interlayer insulating film is used as an etch mask so as to form the copper wirings.
2. The method as claimed in claim 1 , comprising performing the etch process using the chemical solution using an etchant where ammonium hydroxide(NH 4 OH)/hydrogen peroxide(H 2 O 2 )/water(H 2 O) are mixed, wherein the ratio of ammonium hydroxide to hydrogen peroxide is 1:4 to 1:5, and the etch process is performed at a temperature ranging from 25° C. to 80° C. for 2 minutes to 10 minutes.
3. The method as claimed in claim 1 , further comprising, after forming the copper wirings,
(d) forming a second copper anti-diffusion insulating film on the semiconductor substrate including the first interlayer insulating film along a step of a surface;
(e) forming a second interlayer insulating film on the second copper anti-diffusion insulating film;
(f) patterning the second interlayer insulating film and the second copper anti-diffusion insulating film to form via holes; and
(g) burying the via holes with copper and then polishing the via holes.
4. The method as claimed in claim 3 , further comprising, after forming the second copper anti-diffusion insulating film, performing a polishing process using the first interlayer insulating film as a stop layer.