Method for forming deep trench in semiconductor device
View Patent ↗A method for forming a deep trench in a semiconductor device includes: forming a hard mask over a substrate, forming a hard mask pattern over the substrate through etching the hard mask to thereby expose an upper portion of the substrate, forming a first trench through a first etching the exposed substrate using a gas containing bromide and a gas containing chloride and forming a second trench through a second etching the first trench using of a gas containing sulfur and fluorine, wherein a depth of the second trench is deeper than a depth of the first trench.
1. A method for forming a deep trench in a semiconductor device, comprising:
forming a buffer layer over a substrate;
forming a hard mask over the buffer layer, the hard mask comprising a nitride layer and an oxide layer;
forming a hard mask pattern by etching the hard mask to thereby expose an upper portion of the substrate;
forming a first trench in the exposed substrate by performing a first etching process using a gas containing bromide and a gas containing chloride;
forming a second trench having a depth deeper than the first trench through a second etching process where the exposed substrate through a bottom portion of the first trench is etching using a gas containing sulfur and fluoride;
forming a sidewall protective layer on an inner sidewall of the first and the second trenches;
recessing the nitride layer;
removing the oxide layer;
forming a sidewall insulation layer along an inner surface of the first and second trenches after removing the oxide layer; and
forming a device isolation layer to fill the first and the second trenches.
2. The method of claim 1 , wherein the first and the second etching processes are performing in-situ.
3. The method of claim 1 , wherein the gas containing chloride includes one selected from the group consisting of Cl 2 , HCl, SiCl 4 , CCl 4 , BCl 3 , PCl 3 , CHCl 2 F, CHClF 2 , CCl 2 F 2 and ICl.
4. The method of claim 1 , wherein the gas containing bromide includes any one selected from the group consisting of HBr, CF 3 Br, Br 2 and IBr.
5. The method of claim 1 , wherein the first etching process is performed by adding an oxygen gas and a nitrogen gas.
6. The method of claim 5 , wherein the first etching is performed by supplying the nitrogen gas at a flow rate of approximately 5 sccm to approximately 10 sccm, the gas containing chloride at a flow rate of approximately 50 sccm to approximately 100 sccm, the oxygen gas at a flow rate of approximately 50 sccm to approximately 100 sccm, and the gas containing bromide at a flow rate of approximately 50 sccm to approximately 150 sccm.
7. The method of claim 1 , wherein the second etching process is performed by adding an oxygen gas.
8. The method of claim 7 , wherein the second etching process is performed by supplying the gas containing sulfur and fluorine at a flow rate of approximately 20 sccm to approximately 200 sccm and the oxygen gas at a flow rate of approximately 20 sccm to approximately 100 sccm.
9. The method of claim 1 , wherein the first trench has a tilt angle of approximately 70° approximately to 85° between a bottom and an etched sidewall.
10. The method of claim 1 , wherein the first trench has a depth ranges from approximately 5000 Å to approximately 10000 Å.
11. The method of claim 1 , wherein the second trench has a depth ranging from approximately 3 μm to approximately 100 μm.
12. The method of claim 1 , wherein the buffer layer is an oxide layer.
13. The method of claim 1 , wherein the second trench is formed to have more vertical profile than the first trench.
14. A method for forming a deep trench in a semiconductor device, comprising:
forming a hard mask pattern over a substrate, the hard mask pattern comprising a nitride layer and an oxide layer;
forming a first trench in the substrate by performing a first etching process;
forming a second trench having a depth deeper and shallower than the first trench through a second etching process where the substrate through a bottom portion of the first trench is etched;
forming a sidewall protective layer on an inner sidewall of the first and the second trenches;
recessing the nitride layer;
removing the oxide layer;
forming a sidewall insulation layer along an inner surface of the first and second trenches after removing the oxide layer, the sidewall insulation layer comprising oxide layer; and
forming a device isolation layer to fill the first and second trenches, the device isolation layer comprising poly silicon layer;
wherein the first trench has a tilt angle of approximately 70° approximately to 85° between a bottom and the etched sidewall.
15. The method of claim 14 , wherein a polymer is formed over an etched sidewall of the first trench during the first etching process and the polymer prevents an under-cut in an upper portion and the sidewall of the deep trench.
16. The method of claim 14 , wherein the first etching process uses a gas containing bromide and chloride.
17. The method of claim 14 , wherein the second etching process uses a gas containing sulfur and fluoride and oxygen.
18. The method of claim 14 , wherein the first trench has a depth ranging from approximately 5,000 Å to approximately 10,000 Å.
19. The method of claim 14 , wherein the second trench has a depth ranging from approximately 3 μm to approximately 100 μm.
20. The method of claim 14 , wherein the sidewall insulation layer is a stack layer where a first layer formed through an oxide process and a second layer formed through a deposition process are stacked, sequentially.
21. The method of claim 1 , wherein the sidewall protective layer comprises an oxide layer.
22. The method of claim 14 , wherein the sidewall protective layer comprises an oxide layer.