Semiconductor device with high voltage field effect transistor and junction field effect transistor

1. A semiconductor device comprising:

a first junction field effect transistor (JFET) comprising:

a first N-type well region disposed in a substrate;

a second N-type well region abutting the first N-type well region;

a first JFET source region disposed in the first N-type well region;

a common drain region disposed in the second N-type well region; and

a first high voltage field effect transistor (HVFET) comprising:

a first P-type well region formed in the substrate;

a first HVFET source region disposed in the first P-type well region;

the common drain region disposed in the second N-type well region and shared by the first JFET and the first HVFET; and

a first gate electrode formed on the first P-type well region and disposed between the first HVFET source and the common drain region.

2. The semiconductor device of claim 1 , wherein a maximum vertical length of the first JFET source region is greater than a maximum vertical length of the common drain region.

3. The semiconductor device of claim 1 , wherein the first JFET has a rectangular shape in a plan view.

4. The semiconductor device of claim 3 , wherein the rectangular shape has a vertical length greater than a horizontal length.

5. The semiconductor device of claim 1 , wherein the first N-type well region has a cross-sectional area smaller than a cross-sectional area of the second N-type well region.

6. The semiconductor device of claim 1 , wherein the first N-type well region has a maximum depth smaller than or equal to a maximum depth of the second N-type well region with respect to a top surface of the substrate respectively.

7. The semiconductor device of claim 1 , further comprising a P-type gate region disposed between the first N-type well region and the second N-type well region.

8. The semiconductor device of claim 1 , further comprising a second HVFET comprising:

a second P-type well region formed in the substrate;

a second HVFET source region disposed in the second P-type well region;

the common drain region disposed in the second N-type well region; and

a second gate electrode disposed between the second HVFET source region and the common drain region,

wherein the common drain region is shared by the first HVFET and the second HVFET.

9. The semiconductor device of claim 1 , further comprising a second JFET comprising:

a third N-type well region spaced apart from the first N-type well region;

a fourth N-type well region spaced apart from the second N-type well region;

a second JFET source region disposed in the third N-type well region; and

a second common drain region disposed in the fourth N-type well region.

10. The semiconductor device of claim 8 , wherein the first JFET source region does not protrude outwardly from a virtual line connected between an end of the first gate electrode and an end of the second gate electrode.

11. The semiconductor device of claim 1 , wherein the first JFET source region has a length in a vertical direction perpendicular to the first gate electrode having a length in a horizontal direction in a plan view.

12. A semiconductor device comprising:

a junction field effect transistor (JFET) comprising:

an N-type well region disposed in a substrate;

a first JFET source region disposed in the N-type well region; and

a common drain region disposed in the N-type well region; and

a first high voltage field effect transistor (HVFET) comprising:

a first P-type well region spaced apart from the N-type well region;

a first field oxide film formed over the first P-type well region;

a first gate electrode formed over the first field oxide film; and

a first field plate formed over the first field oxide film to overlap the first gate electrode,

wherein the common drain region is shared by the JFET and the first HVFET.

13. The semiconductor device of claim 12 ,

wherein the N-type well region comprises:

a first well region; and

a second well region abutting the first well region, and

wherein the first JFET source region and the common drain region are formed in the first well region and the second well region, respectively.

14. The semiconductor device of claim 12 ,

wherein the N-type well region has a maximum depth larger than that of the first P-type well region with respect to a top surface of the substrate.

15. The semiconductor device of claim 14 , further comprising a P-type buried layer spaced apart from a bottom surface of the first field oxide film.

16. The semiconductor device of claim 12 , further comprising a second HVFET comprising:

a second P-type well region spaced apart from the N-type well region;

a second field oxide film formed over the second P-type well region;

a second gate electrode formed over the second field oxide film; and

a second field plate formed over the second field oxide film to overlap the second gate electrode,

wherein the common drain region is shared by the first HVFET and the second HVFET.

17. The semiconductor device of claim 16 , wherein the first and second HVFETs further comprise a first HVFET source region and a second HVFET source region, respectively.

18. The semiconductor device of claim 16 , wherein the first JFET source region does not protrude outwardly from a virtual line connected between an end of the first gate electrode and an end of the second gate electrode.

19. The semiconductor device of claim 12 , wherein the first JFET source region has a length in a vertical direction perpendicular to the first gate electrode having a length in a horizontal direction in a plan view.

20. The semiconductor device of claim 12 , wherein the JFET further comprises a P-type gate region formed in the N-type well region.