Patent Assignment
Reel/Frame 065755/0437
Assignment of Assignor's Interest
Recorded: 2023-12-04
Pages: 5
Assignors
HWANG, JUNSUN
Executed: 2023-11-01
PARK, SEWOONG
Executed: 2023-11-01
LEE, JEONGHO
Executed: 2023-11-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same
Application:
18/504,479 →
Publication:
US 2024/0178230