Patent Assignment
Reel/Frame 065759/0721
Assignment of Assignor's Interest
Recorded: 2023-12-05
Pages: 6
Assignors
HWANG, JUN CHUL
Executed: 2023-11-27
KIM, SUNG IL
Executed: 2023-11-27
AHN, YONG HO
Executed: 2023-11-27
CHOI, JAE HUN
Executed: 2023-11-28
LEE, TAEK SUN
Executed: 2023-11-28
JEON, HWANG
Executed: 2023-11-28
HONG, JUN
Executed: 2023-11-28
JUNG, JI WON
Executed: 2023-11-28
Assignees
SAMSUNG ENGINEERING CO., LTD.
26, SANGIL-RO 6-GIL, GANGDONG-GU, SEOUL, 05288, KOREA, REPUBLIC OF
MORAI INC.
12F, 501 TEHERAN-RO, GANGNAM-GU, SEOUL, 06168, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Simulation Method and Three-Dimensional Simulation Apparatus
Application:
18/528,138 →
Publication:
US 2025/0087092
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.