Patent Assignment
Reel/Frame 065769/0402
Assignment of Assignor's Interest
Recorded: 2023-12-05
Pages: 9
Assignors
IIZUKA, KENTARO
Executed: 2023-11-28
HIRATA, KAZUYA
Executed: 2023-11-27
IGA, HAYATO
Executed: 2023-11-28
OZAWA, HIRONOBU
Executed: 2023-11-27
HATTORI, MATO
Executed: 2023-11-22
IWATA, HIDEO
Executed: 2023-11-27
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing Apparatus