Patent Assignment
Reel/Frame 065795/0825
Assignment of Assignor's Interest
Recorded: 2023-12-07
Pages: 8
Assignors
YASUI, TAKESHI
Executed: 2020-03-03
FUNAKI, KATSUNORI
Executed: 2020-03-03
MUROBAYASHI, MASAKI
Executed: 2020-03-03
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.