Patent Assignment
Reel/Frame 065796/0001
Assignment of Assignor's Interest
Recorded: 2023-12-07
Pages: 14
Assignors
CHOI, JAEMYUNG
Executed: 2023-08-30
SEO, KANG-ILL
Executed: 2023-08-31
PARK, SE JUNG
Executed: 2023-08-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including a Conductive via and Methods of Forming the Same
Application:
18/459,894 →
Publication:
US 2024/0355727