Patent Assignment
Reel/Frame 065796/0863
Assignment of Assignor's Interest
Recorded: 2023-12-07
Pages: 4
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 1057325, JAPAN
Covered Property
(1)
Resin Composition, Resin Film, Printed Wiring Board, and Semiconductor Package
Application:
18/566,877 →
Publication:
US 2024/0279478
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.