Patent Assignment
Reel/Frame 065799/0601
Assignment of Assignor's Interest
Recorded: 2023-12-07
Pages: 16
Assignors
GAO, JIANFENG
Executed: 2023-11-27
LIU, WEIBING
Executed: 2023-11-27
LI, JUNJIE
Executed: 2023-11-27
ZHOU, NA
Executed: 2023-11-27
YANG, TAO
Executed: 2023-11-27
LI, JUNFENG
Executed: 2023-11-27
LUO, JUN
Executed: 2023-11-27
Assignee
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
NO.3 BEITUCHENG WEST ROAD, CHAOYANG DISTRICT, BEIJING, 100029, CHINA
Covered Property
(1)
Metal Interconnection Structure of Semiconductor Device and Method for Forming the Same
Application:
18/532,246 →
Publication:
US 2024/0194598